"On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield ..."

Adit D. Singh, C. Mani Krishna (1991)

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DOI: 10.1109/TEST.1991.519514

access: closed

type: Conference or Workshop Paper

metadata version: 2022-09-10

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Adit D. Singh, C. Mani Krishna:
On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction. ITC 1991: 228-237

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