"A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs."

Rashid Rashidzadeh et al. (2015)

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DOI: 10.1109/TEST.2015.7342390

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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Rashid Rashidzadeh, Esrafil Jedari, Tareq Muhammad Supon, Vladimir Mashkovtsev:
A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs. ITC 2015: 1-9

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