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"Solutions to Multiple Probing Challenges for Test Access to Multi-Die ..."

Erik Jan Marinissen et al. (2018)

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DOI: 10.1109/TEST.2018.8624731

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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  - https://dblp.org/rec/conf/itc/MarinissenFPSJW18
Erik Jan Marinissen, Ferenc Fodor, Arnita Podpod, Michele Stucchi, Yu-Rong Jian, Cheng-Wen Wu:
Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits. ITC 2018: 1-10

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