"A novel method to mitigate TSV electromigration for 3D ICs."

Yuanqing Cheng et al. (2013)

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DOI: 10.1109/ISVLSI.2013.6654633

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dillio, Patrick Girard, Arnaud Virazel, Pascal Vivet, Marc Belleville:
A novel method to mitigate TSV electromigration for 3D ICs. ISVLSI 2013: 121-126

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