


default search action
"Mitigating Partitioning, Routing, and Yield Concerns in 3D ICs by ..."
Michael Buttrick, Sandip Kundu (2011)
- Michael Buttrick, Sandip Kundu:
Mitigating Partitioning, Routing, and Yield Concerns in 3D ICs by Multiplexing TSVs. ISVLSI 2011: 194-199

manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.