"Two 10Gb/s/pin Low-Power Interconnect Methods for 3D ICs."

Qun Gu et al. (2007)

Details and statistics

DOI: 10.1109/ISSCC.2007.373487

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-07

a service of  Schloss Dagstuhl - Leibniz Center for Informatics