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"26.6 A 2.667Gb/s DDR3 memory interface with asymmetric ODT on wirebond ..."

Shang-Ping Chen et al. (2014)

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DOI: 10.1109/ISSCC.2014.6757508

access: closed

type: Conference or Workshop Paper

metadata version: 2020-08-17

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  - conf/isscc/ChenHCCLHHLL14
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Shang-Ping Chen, Chih-Chien Hung, Qui-Ting Chen, Sheng-Ming Chang, Ming-Shi Liou, Bo-Wei Hsieh, Hsiang-I Huang, Brian Liu, Yan-Bin Luo:
26.6 A 2.667Gb/s DDR3 memory interface with asymmetric ODT on wirebond package and single-side-mounted PCB. ISSCC 2014: 448-449

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