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"Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs."

Taigon Song et al. (2011)

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DOI: 10.1109/ISQED.2011.5770714

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/isqed/SongLKLCKPAKY11
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  persistent URL:
  - https://dblp.org/rec/conf/isqed/SongLKLCKPAKY11
Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon:
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. ISQED 2011: 122-128

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