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"3D IC Packaging Utilizing a Metal Structure for Heat Reduction, Noise ..."
Nahid Mirzaie, Ron Rohrer (2021)
- Nahid Mirzaie, Ron Rohrer:
3D IC Packaging Utilizing a Metal Structure for Heat Reduction, Noise Shielding, and High Interconnect Density. ISQED 2021: 269-274
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