"Efficient design practices for thermal management of a TSV based 3D IC system."

Zongwu Tang (2010)

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DOI: 10.1145/1735023.1735043

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Zongwu Tang:
Efficient design practices for thermal management of a TSV based 3D IC system. ISPD 2010: 59

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