Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"TSV-constrained micro-channel infrastructure design for cooling stacked ..."

Bing Shi, Ankur Srivastava (2012)

> Home

Details and statistics

DOI: 10.1145/2160916.2160941

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-18

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ispd/ShiS12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ispd/ShiS12
Bing Shi, Ankur Srivastava:
TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs. ISPD 2012: 113-118

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.