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"Recent advances in TSV inductors for 3D IC technology."

Bruce C. Kim, Sang-Bock Cho (2016)

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DOI: 10.1109/ISOCC.2016.7799702

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Bruce C. Kim, Sang-Bock Cho:
Recent advances in TSV inductors for 3D IC technology. ISOCC 2016: 29-30

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