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"Intra- and inter-chip voltage droop analysis using a power delivery grid ..."

Wing Oi Siu, Terrence S. T. Mak (2014)

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DOI: 10.1109/ISICIR.2014.7029549

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-19

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Wing Oi Siu, Terrence S. T. Mak:
Intra- and inter-chip voltage droop analysis using a power delivery grid model. ISIC 2014: 208-211

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