"Heat Mitigation in 3D ICs by Improvised TTSV Structure."

Debika Chaudhuri et al. (2020)

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DOI: 10.1109/ISDCS49393.2020.9262977

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-03

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Debika Chaudhuri, Dalia Nandi Das, Hafizur Rahaman, Tamal Ghosh:
Heat Mitigation in 3D ICs by Improvised TTSV Structure. ISDCS 2020: 1-4

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