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"Buffered-Interconnect Performance and Power Dissipation in 3D ICs with ..."

Satya K. Vendra, Malgorzata Chrzanowska-Jeske (2018)

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DOI: 10.1109/ISCAS.2018.8351416

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Satya K. Vendra, Malgorzata Chrzanowska-Jeske:
Buffered-Interconnect Performance and Power Dissipation in 3D ICs with Temperature Profile. ISCAS 2018: 1-5

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