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"Layer ordering to minimize TSVs in heterogeneous 3-D ICs."

Boris Vaisband, Eby G. Friedman (2016)

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DOI: 10.1109/ISCAS.2016.7538950

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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  dblp key:
  - conf/iscas/VaisbandF16
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  - https://dblp.org/rec/conf/iscas/VaisbandF16
Boris Vaisband, Eby G. Friedman:
Layer ordering to minimize TSVs in heterogeneous 3-D ICs. ISCAS 2016: 1926-1929

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