"Hardware-software co-design of an embedded power management module with ..."

Rajdeep Bondade, Dongsheng Ma (2010)

> Home

Details and statistics

DOI: 10.1109/ISCAS.2010.5537515

access: closed

type: Conference or Workshop Paper

metadata version: 2020-08-24

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/iscas/BondadeM10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iscas/BondadeM10
Rajdeep Bondade, Dongsheng Ma:
Hardware-software co-design of an embedded power management module with adaptive on-chip power processing schemes. ISCAS 2010: 617-620

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.