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"A Realistic Modeling Approach To Explain the Physical Mechanism of TDDB ..."

C. H. Yang et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764607

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-09

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  dblp key:
  - conf/irps/YangCCH22
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C. H. Yang, P. S. Chien, Y. S. Cho, W. S. Hung:
A Realistic Modeling Approach To Explain the Physical Mechanism of TDDB For Automotive Grade-Zero Applications. IRPS 2022: 28-1

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