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"Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging."

Takuya Wadatsumi et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764457

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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  dblp key:
  - conf/irps/WadatsumiKHMNMH22
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  persistent URL:
  - https://dblp.org/rec/conf/irps/WadatsumiKHMNMH22
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Takuji Miki, Makoto Nagata, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo:
Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging. IRPS 2022: 14-1

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