"Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for ..."

Stéphane Moreau et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10118173

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne:
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS 2023: 1-7

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