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"Reliability Challenges from 2.5D to 3DIC in Advanced Package Development."

Ryan Lu et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117647

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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  dblp key:
  - conf/irps/LuCWH23
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  - https://dblp.org/rec/conf/irps/LuCWH23
Ryan Lu, Yao-Chun Chuang, Jyun-Lin Wu, Jun He:
Reliability Challenges from 2.5D to 3DIC in Advanced Package Development. IRPS 2023: 1-4

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