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"Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic ..."

Sungmock Ha et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10118277

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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  - conf/irps/HaLBLKWLLP23
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Sungmock Ha, S. Lee, G. H. Bae, D. S. Lee, S. H. Kim, B. W. Woo, N.-H. Lee, Y. S. Lee, S. Pae:
Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs. IRPS 2023: 1-7

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