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"Effects of Wiring Density and Pillar Structure on Chip Package Interaction ..."

Weishen Chu et al. (2020)

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DOI: 10.1109/IRPS45951.2020.9128333

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-30

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  dblp key:
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Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho:
Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. IRPS 2020: 1-4

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