"The Effects of Process Variations and BTI in Packaged FinFET Devices."

Emmanuel Bender, Joseph B. Bernstein, Duane S. Boning (2023)

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DOI: 10.1109/IRPS48203.2023.10117980

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-12

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Emmanuel Bender, Joseph B. Bernstein, Duane S. Boning:
The Effects of Process Variations and BTI in Packaged FinFET Devices. IRPS 2023: 1-5

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