"A New Methodology to Evaluate Die-Package Level Load-Pull and Ruggedness ..."

P. Srinivasan et al. (2025)

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DOI: 10.1109/IRPS48204.2025.10982771

access: closed

type: Conference or Workshop Paper

metadata version: 2025-06-04

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P. Srinivasan, Oscar H. Gonzalez, J. Lestage, Stephen Moss, Oscar D. Restrepo, S. Ludvik:
A New Methodology to Evaluate Die-Package Level Load-Pull and Ruggedness for RF Long Term Aging for 5G Applications. IRPS 2025: 72

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