"A Novel Packaging Stress Isolation Chip for MEMS Devices."

Bowen Xing et al. (2019)

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DOI: 10.1109/SENSORS43011.2019.8956845

access: closed

type: Conference or Workshop Paper

metadata version: 2024-07-30

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  - https://dblp.org/rec/conf/ieeesensors/XingZWHLWZ19
Bowen Xing, Bin Zhou, Jin Wang, Bo Hou, Xiang Li, Qi Wei, Rong Zhang:
A Novel Packaging Stress Isolation Chip for MEMS Devices. IEEE SENSORS 2019: 1-3

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