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"An on-chip thermal stress evaluation method for silicon resonant ..."

Guo Ming Xia et al. (2016)

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DOI: 10.1109/ICSENS.2016.7808511

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-23

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  dblp key:
  - conf/ieeesensors/XiaSQYP16
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  - https://dblp.org/rec/conf/ieeesensors/XiaSQYP16
Guo Ming Xia, Qin Shi, An Ping Qiu, Xuehao Yu, Zhonghai Pei:
An on-chip thermal stress evaluation method for silicon resonant accelerometer. IEEE SENSORS 2016: 1-3

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