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"Laser ReSeal - Combination of Accelerometer and Gyroscope Sensors in a ..."

Holger Rumpf et al. (2020)

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DOI: 10.1109/SENSORS47125.2020.9278830

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-13

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  - conf/ieeesensors/RumpfFRBSA20
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  - https://dblp.org/rec/conf/ieeesensors/RumpfFRBSA20
Holger Rumpf, Jens Frey, Kurt-Ulrich Ritzau, Achim Breitling, Peter Staffeld, Mawuli Ametowobla:
Laser ReSeal - Combination of Accelerometer and Gyroscope Sensors in a Single MEMS Chip Silicon Wafer Processing Technology for Six Degrees of Freedom in Inertial Sensors. IEEE SENSORS 2020: 1-4

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