"A Wafer-level Package Design with Symmetrical Out-plane Electrodes for ..."

Jianjun Ma et al. (2024)

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DOI: 10.1109/SENSORS60989.2024.10784701

access: closed

type: Conference or Workshop Paper

metadata version: 2025-02-04

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  - conf/ieeesensors/MaCHC00024
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  - https://dblp.org/rec/conf/ieeesensors/MaCHC00024
Jianjun Ma, Jincui Cui, Shuangxin Huang, Qilin Cai, Qi Wei, Bin Zhou, Rong Zhang:
A Wafer-level Package Design with Symmetrical Out-plane Electrodes for 3D-MEMS Devices. IEEE SENSORS 2024: 1-4

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