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"Non-contact measurement of silicon thin wafer warpage by THz tomography ..."

Thomas Arnold et al. (2016)

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DOI: 10.1109/ICSENS.2016.7808808

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-15

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  dblp key:
  - conf/ieeesensors/ArnoldSKH16
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Thomas Arnold, Johannes Schicker, Martin Kraft, Christina Hirschl:
Non-contact measurement of silicon thin wafer warpage by THz tomography and laser triangulation. IEEE SENSORS 2016: 1-3

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