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"Investigation of Potting Compounds on Thermal-Fatigue properties of Solder ..."

Leiming Du et al. (2022)

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DOI: 10.1109/IECON49645.2022.9968578

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  dblp key:
  - conf/iecon/DuZWPDZ22
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  - https://dblp.org/rec/conf/iecon/DuZWPDZ22
Leiming Du, Xiujuan Zhao, Piet Watté, René Poelma, Willem D. van Driel, Guoqi Zhang:
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects. IECON 2022: 1-5

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