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"Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under ..."

Huanpeng Wang, Jingrou Wang, Yuehang Xu (2020)

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DOI: 10.1109/ICTA50426.2020.9332071

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-02

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Huanpeng Wang, Jingrou Wang, Yuehang Xu:
Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under Thermal Shock and Random Vibration. ICTA 2020: 100-101

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