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"Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist."

Kyounghwan Na et al. (2006)

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DOI: 10.1109/ICMENS.2006.348211

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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  - conf/icmens/NaKLKLC06
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  - https://dblp.org/rec/conf/icmens/NaKLKLC06
Kyounghwan Na, Il-hwan Kim, Eunsung Lee, Hyeon Cheol Kim, Yong-Hwan Lee, Kukjin Chun:
Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist. ICMENS 2006: 31-34

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