Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Pre-bond Testing of TSVs in 3D IC Using Segmented Cellular Automata."

Bidesh Chakraborty, Mamata Dalui (2017)

> Home

Details and statistics

DOI: 10.1007/978-981-10-7590-2_9

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/icitam/ChakrabortyD17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icitam/ChakrabortyD17
Bidesh Chakraborty, Mamata Dalui:
Pre-bond Testing of TSVs in 3D IC Using Segmented Cellular Automata. ICITAM 2017: 131-139

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.