Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Research on Thermal Coupling Modeling for Multi-chip Paralleled IGBT ..."

Yang Zhou, Zhijun Bai (2023)

> Home

Details and statistics

DOI: 10.1109/ICISCAE59047.2023.10393456

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/iciscae/ZhouB23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iciscae/ZhouB23
Yang Zhou, Zhijun Bai:
Research on Thermal Coupling Modeling for Multi-chip Paralleled IGBT Modules Based on Thermal Resistance Network. ICISCAE 2023: 407-410

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.