"Automatic inspection of solder joints using layered illumination."

Tae-Hyeon Kim et al. (1996)

> Home

Details and statistics

DOI: 10.1109/ICIP.1996.560960

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/icip/KimCMP96
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icip/KimCMP96
Tae-Hyeon Kim, Tai-Hoon Cho, Young Shik Moon, Sung-Han Park:
Automatic inspection of solder joints using layered illumination. ICIP (2) 1996: 645-648

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.