"Tracking plasma etch process variations using principal component analysis ..."

Beibei Ma, Seán F. McLoone, John V. Ringwood (2007)

> Home

Details and statistics

DOI: —

access: unavailable

type: Conference or Workshop Paper

metadata version: 2018-03-23

- no documents available
- export record
  dblp key:
  - conf/icinco/MaMR07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icinco/MaMR07
Beibei Ma, Seán F. McLoone, John V. Ringwood:
Tracking plasma etch process variations using principal component analysis of oes data. ICINCO-SPSMC 2007: 361-364

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.