"Comprehensive study of wire bond reliability impacts from wire, molding ..."

Lois Jinzhi Liao et al. (2019)

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DOI: 10.1109/ICICDT.2019.8790873

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-18

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Lois Jinzhi Liao, Xi Zhang, Xiaomin Li, Younan Hua, Chao Fu, Weikok Tee, Boonhwa Yee, Bisheng Wang, Songlin Mao:
Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination. ICICDT 2019: 1-6

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