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"Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit."
Mohammed Bougataya et al. (2010)
- Mohammed Bougataya, Oussama Berriah, Ahmed Lakhssassi, Adel-Omar Dahmane, Yves Blaquière, Yvon Savaria, Richard Norman, Richard Prytula:
Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit. ICECS 2010: 315-318
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