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"Multi-chip packaging for high performance systems."

Clinton C. Chao et al. (1988)

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DOI: 10.1109/ICCD.1988.25663

access: closed

type: Conference or Workshop Paper

metadata version: 2021-07-28

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Clinton C. Chao, Kim H. Chen, Ravi Kaw, Jacques Leibovitz, V. K. Nagesh, Kenneth D. Scholz:
Multi-chip packaging for high performance systems. ICCD 1988: 76-81

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