![](https://dblp.uni-trier.de/img/logo.ua.320x120.png)
![](https://dblp.uni-trier.de/img/dropdown.dark.16x16.png)
![](https://dblp.uni-trier.de/img/peace.dark.16x16.png)
Остановите войну!
for scientists:
![search dblp search dblp](https://dblp.uni-trier.de/img/search.dark.16x16.png)
![search dblp](https://dblp.uni-trier.de/img/search.dark.16x16.png)
default search action
"Electromigration modeling and full-chip reliability analysis for BEOL ..."
Mohit Pathak et al. (2011)
- Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim
:
Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. ICCAD 2011: 555-562
![](https://dblp.uni-trier.de/img/cog.dark.24x24.png)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.