Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"A low-overhead fault tolerance scheme for TSV-based 3D network on chip links."

Igor Loi et al. (2008)

> Home

Details and statistics

DOI: 10.1109/ICCAD.2008.4681638

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/iccad/LoiMLFB08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iccad/LoiMLFB08
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu Fujita, Luca Benini:
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links. ICCAD 2008: 598-602

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.