"Pad assignment for die-stacking System-in-Package design."

Yu-Chen Lin et al. (2009)

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DOI: 10.1145/1687399.1687445

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-09

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Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang:
Pad assignment for die-stacking System-in-Package design. ICCAD 2009: 249-255

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