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"Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal ..."

Haiyang He et al. (2023)

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DOI: 10.1109/ICCAD57390.2023.10323972

access: closed

type: Conference or Workshop Paper

metadata version: 2024-01-03

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  dblp key:
  - conf/iccad/HeCYKXLR23
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  - https://dblp.org/rec/conf/iccad/HeCYKXLR23
Haiyang He, Norman Chang, Jie Yang, Akhilesh Kumar, Wenbo Xia, Lang Lin, Rishikesh Ranade:
Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization. ICCAD 2023: 1-7

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