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"Efficient Thermal Placement of Standard Cells in 3D ICs using a Force ..."

Brent Goplen, Sachin S. Sapatnekar (2003)

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DOI: 10.1109/ICCAD.2003.1257591

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  persistent URL:
  - https://dblp.org/rec/conf/iccad/GoplenS03
Brent Goplen, Sachin S. Sapatnekar:
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach. ICCAD 2003: 86-90

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