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"ThermalScope: multi-scale thermal analysis for nanometer-scale integrated ..."

Nicholas Allec et al. (2008)

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DOI: 10.1109/ICCAD.2008.4681639

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  - conf/iccad/AllecHSDY08
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  persistent URL:
  - https://dblp.org/rec/conf/iccad/AllecHSDY08
Nicholas Allec, Zyad Hassan, Li Shang, Robert P. Dick, Ronggui Yang:
ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits. ICCAD 2008: 603-610

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