"Absorb: Deadlock Resolution for 2.5D Modular Chiplet Based Systems."

Yi Yang et al. (2023)

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DOI: 10.1007/978-981-97-0834-5_27

access: closed

type: Conference or Workshop Paper

metadata version: 2024-03-25

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  - conf/ica3pp/YangLDWMS23
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Yi Yang, Tiejun Li, Yi Dai, Bo Wang, Sheng Ma, Yanqiang Sun:
Absorb: Deadlock Resolution for 2.5D Modular Chiplet Based Systems. ICA3PP (1) 2023: 474-487

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