"Non-contact thermal sensing on acoustic-enabled IoT devices."

Henglin Pu et al. (2019)

> Home

Details and statistics

DOI: 10.1145/3341162.3343842

access: closed

type: Conference or Workshop Paper

metadata version: 2024-07-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/huc/PuCHZ19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/huc/PuCHZ19
Henglin Pu, Chao Cai, Menglan Hu, Rong Zheng:
Non-contact thermal sensing on acoustic-enabled IoT devices. UbiComp/ISWC Adjunct 2019: 176-178

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.