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"Temperature-constrained fixed-outline floorplanning for die-stacking ..."
De-Yu Liu, Wai-Kei Mak, Ting-Chi Wang (2010)
- De-Yu Liu, Wai-Kei Mak, Ting-Chi Wang:
Temperature-constrained fixed-outline floorplanning for die-stacking system-in-package design. ACM Great Lakes Symposium on VLSI 2010: 423-428
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