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"BISTs for post-bond test and electrical analysis of high density 3D ..."

Imed Jani et al. (2018)

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DOI: 10.1109/ETS.2018.8400698

access: closed

type: Conference or Workshop Paper

metadata version: 2018-07-06

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Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné:
BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. ETS 2018: 1-6

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